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MEMS Sensor
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> Products > WLCSP
Cost Low package/test cost
I/O Density Fine pitch, High No. of I/O
Integration Integrated passives & System in a package
Dimension small package size/height
Performance Short interconnect line length
CIS Image Sensor Wafer Level Chip Scale Package (WLCSP)
WLCSP with real TSV structure
Standard SMT assembly
Smaller form factor in X, Y, Z
Particle free packaging including cavity area
No need for image sensor design
Extendible to 3DIC integration